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Testing Of InterposerBased 25D Integrated Circuits Ran Wa

 
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MessagePosté le: Sam 8 Juil - 09:16 (2017)    Sujet du message: Testing Of InterposerBased 25D Integrated Circuits Ran Wa Répondre en citant











Testing of Interposer-Based 2.5D Integrated Circuits format eReader thepiratebay text online





Table of contents (8 chapters) Introduction Wang, Ran (et al.) Pages 1-15 Preview Buy Chapter 30,19 Pre-bond Testing of the Silicon Interposer Wang, Ran (et al.) Pages 17-48 Preview Buy Chapter 30,19 Post-bond Scan-Based Testing of Interposer Interconnects Wang, Ran (et al.) Pages 49-80 Preview Buy Chapter 30,19 Test Architecture and Test-Path Scheduling Wang, Ran (et al.) Pages 81-108 Preview Buy Chapter 30,19 Built-In Self-Test Wang, Ran (et al.) Pages 109-133 Preview Buy Chapter 30,19 ExTest Scheduling and Optimization Wang, Ran (et al.) Pages 135-162 Preview Buy Chapter 30,19 A Programmable Method for Low-Power Scan Shift in SoC Dies Wang, Ran (et al.) Pages 163-178 Preview Buy Chapter 30,19 Conclusions Wang, Ran (et al.) Pages 179-182 Preview Buy Chapter 30,19 Show next xx By Topic Aerospace Bioengineering Communication, Networking & Broadcasting Components, Circuits, Devices & Systems Computing & Processing Engineered Materials, Dielectrics & Plasmas Engineering Profession Fields, Waves & Electromagnetics General Topics for Engineers Geoscience Nuclear Engineering Photonics & Electro-Optics Power, Energy, & Industry Applications Robotics & Control Systems Signal Processing & Analysis Transportation Use of this web site signifies your agreement to the terms and conditionsIEEE Account Change Username/Password Update Address Purchase Details Payment Options Order History View Purchased Documents Profile Information Communications Preferences Profession and Education Technical Interests Need Help? US & Canada: +1 800 678 4333 Worldwide: +1 732 981 0060 Contact & Support About IEEE Xplore Contact Us Help Terms of Use Nondiscrimination Policy Sitemap Privacy & Opting Out of Cookies A not-for-profit organization, IEEE is the world's largest technical professional organization dedicated to advancing technology for the benefit of humanityBuy eBook - UAH1,540.53Get this book in printSpringer ShopAmazon.comFind in a libraryAll sellers 0 ReviewsWrite review of Interposer-Based 2.5D Integrated CircuitsBy Ran Wang, Krishnendu Chakrabarty About this bookTermsofServicePages displayed by permission of Springer.Copyright.Page 15 .IEEE.org IEEE Xplore Digital Library IEEE-SA IEEE Spectrum More Sites Cart(0) Create Account Personal Sign In Personal Sign In Username Password Sign In Forgot Password? The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC diesUse of this web site signifies your agreement to the terms and conditionsChakrabarty is a recipient of the National Science Foundation CAREER award, the Office of Naval Research Young Investigator award, the Humboldt Research Award from the Alexander von Humboldt Foundation, Germany, the IEEE Transactions on CAD Donald ORead this book on SpringerLink Download Preface 1 PDF (44.1 KB) Download Sample pages 2 PDF (2.3 MB) Download Table of contents PDF (176.4 KB)This book covers many testing techniques that have already been used in mainstream semiconductor companiesWangreceived the BHe has been at Duke University since 1998Moreover, due to higher integration levels, test-application time and test power consumption for 2.5D ICs are also increased compared to their 2D counterpartsInstitutional Sign In degrees from the University of Michigan, Ann Arbor in 1992 and 1995, respectivelyThe authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer,Show all 07f867cfac


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